Underfill is used in interconnect devices for example with BGAs and flip chips to compensate the temperature expansions between the actual chip and the interconnect device. The underfill significantly improves the reliability and the service life.
The following valves are suitable for applying underfill:
Optionally, the media temperature control or substrate heating can be integrated to optimise the underfill process.
Depending on the material used, an additional suck-back option can be integrated for the retention of the medium during pauses in dispensing. This prevents the formation of drips with low viscosity media.