Electronical Applications
The dispensing machine dispenseALL with its numerous options provides the perfect solution for your application in electronics manufacturing.
Dispensing solder pastes
In applications where no stencils can be used for the paste print, dispensing the solder paste by way of a dispenser is a flexible and accurate alternative. More...
SMD glue dispensing
Although in the meantime, components are no longer glued in the production of SMTs where possible, in order to alleviate subsequent repair work, for example, there still are applications where components are glued. More...
Silver conductive paste dispensing
Silver conductive pastes can be applied as an alternative to traditional solder paste anywhere that interconnect devices or components are sensitive to temperature and a standard soldering process cannot be used. More...
Underfill dispensing
Underfill is used in circuits with BGAs and flip chips to compensate the differences in the temperature expansions between the component and the interconnect device. More...
Potting
Components and top performers are mounted in cases which are filled with different media to enlarge their life-time. Therefore FRITSCH offers the ideal solution to guarantee a solid and safe processing. In one or more operations the potting can be made with different media. More...
Dam and Fill
Two different materials are used in the dam and fill process. A high and a low-viscous substance. First the material with high vicousity is dispensed as a dam around the to be protected component. Than the area inside of the dam is filled with the low viscous material (fill) to coat the circuit completely. The dispensing machine dispenseALL420 enables the use of up to four different media. more...
Conformal Coating
To guarantee functionality and long-time reliability of PCBs the protection of components is necessary. more...
