The reflow oven affords non-polluting, lead free soldering of complex boards with components like QFP, BGA/CSP... Small and medium series are the optimal application for the oven.
The basic machine is disposes of a heating chamber with eight heating zones, in each case four on the top and bottom. The heating zones emit convective heat with the help of hot air blower.
The upper part of the heating chamber includes additional a cooling zone and an exhaust air bonnet in the lead-in and lead-out-area. A pin chain transports the soldering manor.
The soldering system is handled by a modern 7" touch panel. An one-channel temperature sensor is integrated for controlling the contour of soldering on the PCB. An equal thermoelement sensor is in the scope of delivery.
Exhaust air box
The adhesive and soldering fumes generated during operation are harmful to health in the long term. In order to protect the room air from heated exhaust air that may be contaminated with flux fumes, an exhaust air box can be attached to the back of the soldering system, which is available in two different versions. Visually identical, they only differ in performance. The article 903.810.221 has an integrated warm air fan with an air flow of 270 m³/h. The more powerful model (903.810.223) has an air flow of 490 m³/h. A two meter long hot air hose is included in delivery.