Reflow Solder System Details

The reflow oven affords non-polluting, lead free soldering of complex boards with components like QFP, BGA/CSP... Small and medium series are the optimal application for the oven.

The basic machine is disposes of a heating chamber with eight heating zones, in each case four on the top and bottom. The heating zones emit convective heat with the help of hot air blower.

The upper part of the heating chamber includes additional a cooling zone and an exhaust air bonnet in the lead-in and lead-out-area. A grid belt transports the soldering manor.

The soldering system is handled by a modern 7" touch panel. An one-channel temperature sensor is integrated for controlling the contour of soldering on the PCB. An equal thermoelement sensor is in the scope of delivery.