Reflow Solder Systems
FRITSCH offers with the reflow solder system the optimal solution for the production of small up to medium series. The reflow ovens guarantee an environment-friendly lead-free soldering of highest component diversity incl. QFP, BGA/CSP etc. FRITSCH talks about two Systems which are nearly identic. The main difference between the 551.19 and the 551.10 is the active chamber length. The reflow oven 551.19 has a length up to 2125 mm and a usable working width of 405 mm and the 551.10 a length of 850 mm. Both systems are controlled by a user-friendly software which can be fitted to the demands of the solder project.