Assembly:
The Convection Reflow Solder System has a drawer unit for accepting Printed Circuit Boards on individually adjustable supports which are held in place by magnetic feet.The low mass and small contact area of the supports contribute to uniform heating of PCBs.
A microprocessor fully controls the heating process and ensures reliable and reproducible results. Programming and operation is carried out from the clearly arranged keyboard. All data entered by the user and essential information for the operation of each process is shown on the two line LCD display.
Ease of operating:
Operating is made quick and easy by a menu system. Each temperature profile has a four digit number allocated to it which is used for storage and retrieval. There are 9999 memory locations aviable for saving profile parameters.
As soon as the four parameters (pre-heat temperature and time
and reflow temperature and time) for a heating cycle are defined, the process can be started.
Option cover gas N2 Operation:
For a uniform and optimized soldering result there is the option shielding gas nitrogen N2 in two variants.
In one principle, the heating chamber is flooded at the beginning of the soldering process.This is represented in the graph by the red lines. The time of flooding is fixed.
The variant with bypass and door seal, shown with the green lines, allows a variable setting of the time of prefill.After the oven has been brought to a certain value (eg 100 ppm remainder O2), a changeover to bypass can obtain the previously set nitrogen value up to the end of the soldering profile.
