Construction:
The batch soldering system is equipped with a transport drawer in which the circuit board is stored on holders. The holders are provided with magnetic feet so that they can be freely positioned and aligned as required, depending on the size of the circuit board. Another advantage of the low-mass mount is that it can be mounted without thermal stress and optimally in the air flow.
Ease of operating:
Operating is made quick and easy by a menu system. Each temperature profile has a four digit number allocated to it which is used for storage and retrieval. There are 9999 memory locations aviable for saving profile parameters.
As soon as the four parameters (pre-heat temperature and time and reflow temperature and time) for a heating cycle are defined, the process can be started.
Option cover gas N2 Operation:
For a uniform and optimized soldering result there is the option protective gas nitrogen N2 in two variants.
In one principle, the heating chamber is flooded at the beginning of the soldering process. This is represented in the graph by the red lines. The time of flooding is fixed.
The variant with bypass and door seal, shown with the green lines, allows a variable setting of the time of prefill. After the oven has been brought to a certain value (eg 100 ppm remainder O2), a changeover to bypass can obtain the previously set nitrogen value up to the end of the soldering profile.