FRITSCH offers various solder Systems to complete the range of products. There are the adequate ovens for every task like prototyping or series production.
The Systems can be used as stand-alone or connected with pick & place or dispensing machines.
The reflow-soldering of SMD assembled components and the curing process are easy and economic by the use of the Batch-Oven.
The compact size and extremely good value of the Convection Reflow Soldering System makes Surface Mount Reflowing viable even for very small batch sizes.
Different stand-alone and inline reflow soldering systems with approved glide-zone heat chamber systems are available for lead-free or leaded soldering or for the curing of glue.
Outlines of boards or components can be easily measured and analyzed using the integrated thermal sensor.
Several multi-channel measuring instruments are also available.