Distortion free Soldering
To complete the product range, we offer various soldering systems. Whether for prototype or series production, here you will find the right oven for every requirement. Depending on requirements, the systems can be used as a stand-alone variant or connected to automatic placement or dosing machines (inline reflow oven).
Batch-Solder Systems
The reflow-soldering of SMD assembled components and the curing process are easy and economic by the use of the Batch-Oven.
The compact size and extremely good value of the Convection Reflow Soldering System makes Surface Mount Reflowing viable even for very small batch sizes.
Inline Reflow Oven
The hot air convection oven guarantees environmentally friendly, lead-free soldering of printed circuit boards with a large variety of components, including QFP, BGA/CSP, etc. The production of small to medium-sized series is the optimal area of application.
Outlines of boards or components can be easily measured and analyzed using the integrated thermal sensor.
Several multi-channel measuring instruments are also available.