In order to complete our extensive product range, the new reflow oven was included in the production program.
It was already part of our range as a purchased product in a similar form until the end of 2020. When the former OEM supplier ended production, CEO Markus Fritsch took over all the know-how and commissioned his developers and programmers to manufacture the soldering system himself.
With eight heating zones (4 above and 4 below in the active chamber length of 850 mm), a cooling zone and the adjustable pin chain transport from 35 - 395 mm, the hot air assembly oven is perfect for the production of small to medium-sized series. It guarantees environmentally friendly, lead-free soldering of complex printed circuit boards with a large variety of components including QFP, BGA/CSP etc. The system is operated via a modern 7" touch panel in which all zones can be controlled individually and different profiles can be saved. To check the soldering profile, go to A single-channel temperature profiler is integrated in the furnace on the printed circuit board. Using a transport grid, single-sided printed circuit boards can be transported through the oven universally and with little effort. This is an indispensable feature, especially for small prototype circuit boards.