Because of more and more extensive assembly with very small and multi-pin fine-pitch components and QFNs, BGAs and CSPs as well with connectors on the bottom side of the PCB, the manual placement is reaching its limit.
Therefore Fritsch developed the prototype placer placePRO. It combines the advantages of manual placement, such as flexibility of component kitting with the precision of the automatic placement.
Range of applications
Assembling and dispensing of prototypes and zero series up to 4000 components per hour. More than 60 components feeders and PALooseComponents for assembling of loose components included in base packet.
Feeding of components as loose components, tape, stick, tape stripe and tray.
Chips 0201 up to fine pitch 80×80 mm and pitch 0.4 mm, BGAs, CSPs, µBGAs, QFNs and custom parts like connectors, THT-LEDs etc.