Dispensing of solder paste or glue can be done with two different systems:
For dispensing big solder paste dots or glue
- Microprocessor-controlled system
This system detects parameters like cartridge temperature, fill level etc. . It can dispense amounts from 0.001 to 10 mm³. By this Fine-Pitch components down to a pitch of 0.5 mm can be safely dispensed, the ideal solution for prototypes!