The prism optic allows the user to see two overlayed pictures on the monitor - one of the circuit board, and one of the component's connectors. The camera pictures can be zoomed, so that single balls or pins can be inspected.
For larger components, the so-called Split-Field optic can be used. By this the two opposing edges of a component can be overlayed and zoomed.
By using different colors for displaying the circuit board respectively the component on the monitor, the alignment of the current part by the user is fully supported.
The intensity of the colors can be adjusted to the current project's needs.
With the hot-air module, any chip componentes can be soldered in or out.
With the vacuum module, single components can be placed or picked up during soldering-out.
The reballing process makes it possible to provide BGA components with new solder balls. QFN components can be dispensed with new solder paste by using a mini stencil printer. In both cases, these parts can then be reused as normal.
All our tools are designed for the corresponding component model (i.e. with BGA-sized air outlets, FP air outlets only in the area of the pins that need to be soldered). An asymmetric alignment of the outlets allows a consistent heat-up of the component or the braze points (+/- 4K - spread across the whole surface).
The Rapid-IR underheating has advantages over normal infrared or ceramic heaters in terms of flexibility and precisement.The Rapid-IR heater is calibrated once for a project and heats up the circuit board to a predefined temperature.
Once this temperature is reached, it is actively regulated to stay at this value. This gives you big advantages while reworking multilayer boards or during lead-free soldering.