The compact size and extremely good value of the Convection Reflow Soldering System makes Surface Mount Reflowing viable even for very small batch sizes.
Different stand-alone and inline reflow soldering systems with approved glide-zone heat chamber systems are available for lead-free or leaded soldering or for the curing of glue.
Outlines of boards or components can be easily measured and analyzed using the integrated thermal sensor.
Several multi-channel measuring instruments are also available.
